Ultra Thin Density Z Block Long Distances 20km Dwdm Mux IP67

A breakthrough in ultra-long transmission distances of 20 km

The Z-Block high-speed optical module utilizes a combination of EML lasers and APD receivers, achieving 20 km of repeater-free transmission in the 1550 nm window. Its innovative dispersion compensation technology keeps the dispersion coefficient of G.652 optical fiber below 18 ps/(nm·km). Combined with the forward error correction (FEC) algorithm, it maintains a stable bit error rate (BER) of better than 10-12. Test data shows that transmission loss fluctuations do not exceed 0.3 dB within an ambient temperature range of -5°C to 70°C, making it ideal for long-distance scenarios such as metropolitan area network access and the Industrial Internet of Things. The module's built-in intelligent power control unit automatically adjusts the transmitted optical power to ensure optimal signal-to-noise ratio (SNR) at varying link lengths.

Hot-swappable design improves operational efficiency

Utilizing the standard SFP+ package, the Z-Block module supports hot-swappable operation while powered on. Its innovative magnetic connector reduces connect/disconnect time to 0.5 seconds. A dual-color LED indicator on the module housing provides real-time status information (green for normal operation and red for fault). In actual data center deployments, this design reduces the module replacement time for a single switch from 15 minutes compared to traditional solutions to under 30 seconds. The dust and water resistance, IP67-rated, supports rapid maintenance in harsh environments such as humid and dusty environments. The module's lifespan exceeds 5,000 plug-in and plug-out cycles, with an interface wear rate of less than 0.01%.

Environmentally Friendly Materials and Process Innovations

The entire product line is RoHS 2.0 and REACH SVHC certified, with all 158 hazardous substance tests below the required limits. The use of bio-based engineering plastics instead of traditional PC materials reduces the carbon footprint by 42%. Biodegradable corn starch cushioning is used in packaging, eliminating plastic filling during transportation. Lead-free soldering is implemented during production, and a closed-loop recycling system has been established, ensuring a material recovery rate of over 92% at the end of module life. The medical-specific version has passed ISO 10993 biocompatibility testing, fully meeting the requirements for use in sensitive environments such as operating rooms. (AI-generated)