High Speed High Precision Z Block Data Transmission Mux Demux

The Z-Block high-speed optical module features a compact package, only 60% the size of traditional modules (25.4mm × 13.4mm × 9.2mm), supporting high-density deployments. Its innovative vertical stacking design increases port density to 48 ports per 1U rack, making it ideal for micro data centers and edge computing nodes. Built-in micro heat sinks maintain a stable operating temperature at a low power consumption of 0.5W, eliminating the need for additional heat sink space. Field tests show that the module surface temperature remains below 55°C during 72 hours of continuous operation at 100-800Gbps speeds, ensuring reliable operation in confined environments.

The module features a magnetic snap-on design, enabling one-handed hot-swap operation, reducing connect/disconnect times to 0.3 seconds. Self-cleaning ceramic sleeves on the connectors reduce performance degradation caused by dust contamination, resulting in a plug-in/plug-out lifespan exceeding 8,000 cycles. The intelligent diagnostic system provides real-time feedback on parameters such as optical power and temperature via the I2C interface. Combined with management software, it can remotely locate faulty modules, reducing mean time to repair (MTTR) from 20 minutes compared to traditional solutions to less than 2 minutes. A mis-insertion-resistant design ensures precise module-to-port matching, preventing installation errors.

The Z-Block supports dual protocols: 100Gbps Ethernet and 40Gbps Fibre Channel. It utilizes PAM4 modulation technology to boost single-channel speeds to 56Gbps. Its low-latency architecture (<500ns) and dynamic bandwidth allocation meet the real-time data synchronization requirements of scenarios such as financial transactions and cloud computing. In Data Center Interconnect (DCI) testing, the module, coupled with G.654.E fiber, achieved 200km of repeater-free transmission, with a consistently low bit error rate of better than 10-15. In a deployment case for an AI training cluster, the module supports 16TB/hour of parameter synchronization across eight nodes, improving distributed training efficiency by 30%.

The module housing is made of 30% recycled magnesium-aluminum alloy, reducing weight by 15% while maintaining IP67 protection. Lead-free gold plating ensures the PCB is fully RoHS 3.0 compliant and TÜV certified. The packaging uses mushroom mycelium instead of foam plastic, shortening its natural degradation cycle to 90 days. Laser engraving replaces ink markings in the production process to reduce chemical pollution. According to a Life Cycle Assessment (LCA), the carbon footprint of a single module is 37% lower than that of traditional products, contributing to the development of green data centers.